Vender [Good] BGA Reballing Middle Layer Frame for X Repair Logic Board Repair al mejor precio
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calificaciones
419,55 MXN
53% OFF
196,47 MXN
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Descripción del producto
Description:
Middle-Level Layer Board Separate BGA Reballing Middle Frame for phone repair.
High compatible with iPhone X(only for iPhone X), it can help you fixture the motherboard tightly.
Upper Lower Layers board frame will offer best service for professional phone repair.
High temp resistant and anti-static, it is a safety for phone motherboard soldering repair.
Each item has been tested.
Specification:
Material: Plastic
Size: Approx. 5*2.5 cm/1.97*0.98 inch
Package Includes:
1 Piece Middle-Level Layer Board
Especificaciones del producto
Condición | Renovar |
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