43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (1)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (2)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (3)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (4)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (5)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (6)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (7)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (8)
43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone (9)

Vender 43 In 1 IC Chip CPU NAND BGA Remover Thin Blade for Mobile Phone al mejor precio

0
calificaciones
298,4 MXN
48% OFF
153,74 MXN
Se envía desde

Descripción del producto

Description: Phone BGA Chip Remover is common used disassembly tools for small and slightly smaller IC parts on the motherboard of the mobile phone. Ensure the safety during the repair process. Ultra-thin s will offer the best solution to pry out the chip easily without any damage. Perfect cleaning tool for glue removal on phone motherboard. 43 kinds of set which can meet most of the cleaning or repairing operation on motherboard. Specification: Material: Metal Handle Size: Approx. 14.7*1*1 cm/5.79*0.39*0.39 inch Package Includes: 1 Set BGA Chip Repair Tool

Especificaciones del producto

CondiciónRenovar

De la misma tienda

De la misma tienda

También te puede interesar